This picture shows a micro laser mark on a wafer target material. In this instance the size is particularly noteworthy: the character height is only 40µm.
Since the deposited heat of the ps-laser is very little small laser markings without heat affected zones are achievable.
Laser treatment with ultra-short-pulse lasers like the CEPHEUS is a so-called “cold ablation” process.
The equipment used for this example is a WORKSTATION equipped with a ps-laser CEPHEUS and scanner deflection system, both controlled by the PHOTONmark software package.
