Micro lasermarking

The picture shows a micro laser mark with a character size of 40µm on a wafer target material.

Since the deposited heat of the ps-laser is very little small laser markings without heat affected zones are achievable.

Laser treatment with ultra-short-pulse lasers like the CEPHEUS is a so-called “cold ablation” process.

The equipment used for this example is a WORKSTATION equipped with a ps-laser CEPHEUS and scanner deflection system, both controlled by the PHOTONmark software package.

Wafer-micro-lasermarking with a 40µm character size  gold-micro-lasermarking with a 500µm & 200µm character size laser marking system WORKSTATION with ps-Laser CEPHEUS