Laser Micro-Marking




This picture shows a micro laser mark on a wafer target material. In this instance the size is particularly noteworthy: the character height is only 40µm.

Laser Micro Marking on Wafer with Ultrashortpulse-Laser

Laser Micro Marking with Ultrashortpulse-Laser


Since the deposited heat of the ps-laser is very little small laser markings without heat affected zones are achievable.

Laser treatment with ultra-short-pulse lasers like the CEPHEUS is a so-called “cold ablation” process.


The equipment used for this example is a WORKSTATION equipped with a ps-laser CEPHEUS and scanner deflection system, both controlled by the PHOTONmark software package.